Mespack Unveils the MCP Series –
A New Solution for Secondary Packaging
We are pleased to participate in the 2nd edition of PackMach New Delhi, which will take place from October 4th-6th at Pragati Maidan.
Jointly organized by Messe Munchen, IPMMI and PHDCCI, this International trade fair and conference offers an unparalleled experience of witnessing the most cutting-edge technologies and solutions in the packaging and processing industry.
At Mespack we continue to innovate and offer new equipment that suits the needs of our customers. At this event, we will present the new secondary packaging machine with an American case and robotic picking system: the MCP series. A perfect solution for turnkey projects that perfectly integrates the primary packaging with end-of-line.
With regard to our commitment to the environment, we offer solutions that are perfectly adapted to sustainably producing flexible packaging.
Furthermore, at our booth you can discover Athena, our innovative digital platform, that is incorporated in all our intelligent machines.
After 30 years in the flexible packaging market, we have become a comprehensive company that offers the largest product portfolio of the industry, which includes water-soluble single-dose, horizontal form fill seal, vertical form fill seal and end-of-line equipment.
Event Details:
Date: 4th to 6th October ’23
Venue: Pragati Maidan, New Delhi
Hall 12, Booth C 01
We look forward to seeing you in person and having the opportunity to showcase our innovations.
If you have not registered yet, acquire easy access by enrolling with the following link:
In order to offer you a personalized response, we invite you to share your project with us prior to the event: https://mespack.com/contact/.
